Sign In | Join Free | My chinacsw.com
China Shaanxi KeGu New Material Technology Co., Ltd logo
Shaanxi KeGu New Material Technology Co., Ltd
Shaanxi KeGu New Material Technology Co., Ltd
Verified Supplier

1 Years

Home > Boron Nitride Ceramic >

Boron Nitride Ceramic Nozzles & Components for Semiconductor Equipment

Shaanxi KeGu New Material Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Boron Nitride Ceramic Nozzles & Components for Semiconductor Equipment

Brand Name : KEGU

Place of Origin : China

Price : 200-500 yuan/kg

Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram

Supply Ability : 2,000 pcs/month

Packaging Details : Strong wooden box for Global shipping

Model Number : Customizable

Working Temperature : About 2200 Celsius Degree

Thermal Conductivity : 30-50 W/mK

Attribute : Pyrolytic boron nitride crucible

Color : White

Advantage : Stable

Thermal Shock Resistance : Good

Chemical Resistance : Excellent

Hardness : 9 Mohs

Application : Industry Ceramic

Dielectric Strength : 20-30 kV/mm

Feature : Ceramic crucible

Type : Ceramic Parts

Dielectric Constant : 4-5

Material : Boron Nitride

Density : 2.2-2.3 g/cm3

Contact Now

Product Overview: Boron Nitride Ceramic Solutions

Hexagonal Boron Nitride (HBN) ceramics, known as "white graphite," deliver exceptional performance in high-temperature semiconductor applications. With a graphite-like crystal structure and superior thermal properties, HBN components offer outstanding heat resistance, thermal stability, and electrical insulation—making them ideal for demanding semiconductor manufacturing environments.


Key Features & Technical Advantages

  • Excellent Thermal Management: High thermal conductivity ensures efficient heat dissipation in extreme conditions

  • Superior Temperature Resistance: Maintains structural integrity and performance at elevated temperatures

  • Advanced Manufacturing: Hot pressing technology enables production of large components up to 650mm diameter

  • Optimized Material Properties:

    • Very low porosity for enhanced durability

    • Ultra chemical resistance against corrosive environments

    • Direct sintered for net shape manufacturing

    • Mohs hardness 2 allows easy machining into complex geometries


Primary Applications in Semiconductor Equipment

Precision Components:

  • Gas distribution plates & spray nozzles

  • Top nozzles and baffles

  • Pedestal heaters & cover plates

  • RF windows & crucibles

  • Wafer processing components & rings

  • Heat resistant substrates & base materials


Why Choose Our Boron Nitride Ceramics?

Our HBN components are engineered for reliability in the most demanding semiconductor applications. The combination of net shape sintering capability, large diameter manufacturing (up to 650mm), and exceptional thermal properties makes them the optimal choice for:

  • High-temperature thermal management

  • Corrosive environment applications

  • Precision semiconductor manufacturing

  • Custom-shaped components requiring minimal post-processing

Materials Properties:


Boron Nitride Ceramic Nozzles & Components for Semiconductor Equipment

Manufacturing Processes:


Boron Nitride Ceramic Nozzles & Components for Semiconductor Equipment


Boron Nitride Ceramic Nozzles & Components for Semiconductor Equipment




Boron Nitride Ceramic Nozzles & Components for Semiconductor Equipment




Product Tags:

Boron Nitride Ceramic Nozzles

      

Gas Atomization Boron Nitride Ceramic

      

Amorphous BN Ceramic Nozzles

      
Quality Boron Nitride Ceramic Nozzles & Components for Semiconductor Equipment for sale

Boron Nitride Ceramic Nozzles & Components for Semiconductor Equipment Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Shaanxi KeGu New Material Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0