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Brand Name : KEGU
Place of Origin : China
Price : 200-500 yuan/kg
Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability : 2,000 pcs/month
Packaging Details : Strong wooden box for Global shipping
Model Number : Customizable
Working Temperature : About 2200 Celsius Degree
Thermal Conductivity : 30-50 W/mK
Attribute : Pyrolytic boron nitride crucible
Color : White
Advantage : Stable
Thermal Shock Resistance : Good
Chemical Resistance : Excellent
Hardness : 9 Mohs
Application : Industry Ceramic
Dielectric Strength : 20-30 kV/mm
Feature : Ceramic crucible
Type : Ceramic Parts
Dielectric Constant : 4-5
Material : Boron Nitride
Density : 2.2-2.3 g/cm3
Product Overview: Boron Nitride Ceramic Solutions
Hexagonal Boron Nitride (HBN) ceramics, known as "white graphite," deliver exceptional performance in high-temperature semiconductor applications. With a graphite-like crystal structure and superior thermal properties, HBN components offer outstanding heat resistance, thermal stability, and electrical insulation—making them ideal for demanding semiconductor manufacturing environments.
Key Features & Technical Advantages
Excellent Thermal Management: High thermal conductivity ensures efficient heat dissipation in extreme conditions
Superior Temperature Resistance: Maintains structural integrity and performance at elevated temperatures
Advanced Manufacturing: Hot pressing technology enables production of large components up to 650mm diameter
Optimized Material Properties:
Very low porosity for enhanced durability
Ultra chemical resistance against corrosive environments
Direct sintered for net shape manufacturing
Mohs hardness 2 allows easy machining into complex geometries
Primary Applications in Semiconductor Equipment
Precision Components:
Gas distribution plates & spray nozzles
Top nozzles and baffles
Pedestal heaters & cover plates
RF windows & crucibles
Wafer processing components & rings
Heat resistant substrates & base materials
Why Choose Our Boron Nitride Ceramics?
Our HBN components are engineered for reliability in the most demanding semiconductor applications. The combination of net shape sintering capability, large diameter manufacturing (up to 650mm), and exceptional thermal properties makes them the optimal choice for:
High-temperature thermal management
Corrosive environment applications
Precision semiconductor manufacturing
Custom-shaped components requiring minimal post-processing
Materials Properties:

Manufacturing Processes:



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Boron Nitride Ceramic Nozzles & Components for Semiconductor Equipment Images |